Description du projet :
Radio frequency identification (RFID) is a well-established, widespread and fast-growing technology used to identify people, animals and products. The applications of RFID tags encompass the retail, transportation, logistics, healthcare, etc. According to IDTechEx, the retail sector alone was responsible for the demand of 4.6 billion RFID tags in 2016 and is expected to reach 8.1 billion in 2024. The RFID technology is also playing a leading role for manufacturing applications. As part of the Industry 4.0, RFID tags allow more flexible and efficient manufacturing of customized products even in mass-production environments.
In this project, we demonstrate theoretically and experimentally the feasibility of a new assembly approach in which a capacitive-coupled RFID chip will be delivered inside a dielectric droplet, onto the antenna and no longer placed and oriented precisely as it happens nowadays with pick-and-place and flip chip machines. The dielectric droplet (with the encapsulated chip) will self-aligns with respect to the contact thanks to capillary forces driven by specifically designed wetting conditions on the substrate of the antenna. Finally, with few additional steps, the complete passive RFID tag is created.
Research team within HES-SO:
Durée du projet:
03.09.2018 - 30.08.2019
Montant global du projet: 125'000 CHF