Description du projet :
Assytronic = Integrative assemblies of mechatronic products by injection overmolding of sensitive components).
Economic competitiveness is forcing Swiss companies active in the mechatronics sector to increase the degree of integration of their products. Today, assemblies of mechatronic products are mainly carried out through assembly, gluing, welding or screwing operations. These operations used to assemble the components are often restrictive, require a long lead time and are therefore expensive manufacturing steps.
The use of an innovative technology such as the plastic injection overmolding process would allow to realize efficient integrative assemblies. This process allows indeed the elimination of expensive assembly operations and enables a high level of function integration and a high cost reduction.
Mechatronic products are composed of passive components, but also of active electromechanical components like switches, connectors or microphones. Today a complete overmolding of these sensitive components is a big challenge, because of the risk to damage them by the process itself high injection pressures and temperatures).
For each one of the four mechatronic industrial cases of the Assytronic project, the goal is to design and develop a production methodology that allow them to be assembly by the injection overmolding process.
Equipe de recherche au sein de la HES-SO:
Bürgisser Bruno
Partenaires académiques: Institut iRAP - HEIA-FR, HEIA-FR Fribourg
Partenaires professionnels: Phonak Communications SA; Contrinex SA; Mecaplast SA; KBS Spritztechnik CH GmbH; E.M.S. Electro Medical Systems SA; Meggitt SA; HID Global Switzerland SA; Fischer Connectors SA
Durée du projet:
01.03.2020 - 30.06.2021
Montant global du projet: 196'000 CHF
Statut: En cours
SWITCH edu-ID
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